DISTRIBUTED I/O

8-fold push-in 8 x type H1 light bundle contains: 1 x eight-fold carrier 8 x TB type H1 light

ET 200SP HA in R1 bundle R1 IM bundle contains: 1 x carrier module IM 2 x IM 155-6 PN 2 x bus adapter 2xRJ45

ET 200SP HA in single bundle Single IM bundle contains: 1 x carrier module IM 1 x IM 155-6 PN 1 x bus adapter 2xRJ45

SIMATIC ET 200SP HA, PROFINET interface module IM155-6 PN max. 56 I/O modules, multi-hot swap, without server module

SIMATIC ET 200SP HA, bus adapter BA 2xRJ45, 2 RJ45 sockets for PROFINET

SIMATIC ET 200SP HA, 5 TM covers, 22.5 mm, for protection of I/O empty slots

SIMATIC ET 200SP HA, 5 IM covers, 50 mm, for protection of IM empty slots